Detailed Stress Prediction Programs
217 Predicts (Evaluation Associates)
217 Predicts automates MIL-HDBK-217F Notice 1 Reliability predictions.
Features include: tree-structured failure rate summations for subassemblies,
hybrids, equipments and systems, part library is formed as program is used,
capable of making global changes, and multiple report formats which include
sorting, font, title, and other optional capabilities.
ARM E (Advanced Reliability Modeling) (Confidence Enhancements)
Performs MIL-HDBK-217E-1 reliability prediction. Up to 10 environments
can be analyzed and reported on simultaneously. Summary scatter plot ranks
components by temperature and stress levels. Assemblies in system limited
only by available secondary storage space. All four inductor hot spot temperature
approximations are implemented. Commercial part number to MIL-M- 38510
number cross reference from MIL-HDBK 217E.
ARM F (Advanced Reliability Modeling) (Confidence Enhancements)
Performs MIL-HDBK-217F reliability prediction. Up to 10 environments can
be analyzed and reported on simultaneously. Generic resistor/capacitor
part number decoding. Temperature and duty cycle can be varied at the component
and assembly level for each environment. Messages for parameters not specified
or defaulted, for components outside MIL-HDBK-217 derating requirements,
and output flags show defaulting parameters for each component modeled.
CARE® MTBF HDBK-217 Module (Parts Stress) (http://www.bqr.com)
The MTBF prediction module is one of the basic modules that are required
to construct the CARE® integrated design environment.
The tool provides capabilities to construct hierarchical project trees
that include functional blocks and components data. Project tree of 1000
components can be put together in less then an hour.
MTBF predictions are then performed, using a full set of reliability
methods and environments. The CARE® tool includes a library of components
with full reliability data.
The CARE® tool provides a very flexible environment for reliability
prediction.
Predict Failure Rates of components in accordance with the well known
standard: Parts Stress of MIL-HDBK-217
Computer Aided Reliability Program (CARP) (JORI Corp)
Reliability prediction and modeling program developed by the Swiss Federal
Institute of Technology. Performs both Parts Count and Detailed Stress
predictions.
ITEM TOOLKIT: MIL-217 MODULE (Item
Software)
The MIL-217 MODULE of the Item Toolkit program is a reliability prediction
tool based on MIL-HDBK-217F, Notice 2 and includes the Parts Stress and
Parts Count Methods. The reliability prediction modules contain automatic
computation of failure rates, Pi Factor Rates, redundancy calculations,
user defined linked blocks, global editing, and has comprehensive parts
libraries.
The Item Toolkit offers tools for performing MIL-HDBK-217, Telcordia,
and Mechanical Reliability Predictions, Failure Mode Effects Analysis (FMECA),
and Reliability Block Diagram (RBD), and Fault Tree analyses in one integrated
program.
Independent tools are also offered for FMEA (ISO 9000, QS 9000, SAE-J1739)
and Maintainability analysis.
Dramatic time savings over manual methods. Confidence in the accuracy of
calculations. Ability to link with CAD and other external systems. User
friendliness especially for unskilled computer users. Rapid trade-off Studies,
and "what if" iterations to improve system reliability. Runs under Windows.
Milstress (Mitchell & Gothier)
Reliability prediction according to MIL-HDBK-217 features include: error
checking, default values, hierarchical structure, accepts hybrids, electronic
and nonelectronic commercial parts libraries available. Automatic part
entry from libraries and databases, full help facility, accepts nonstandard
parts, instant display of failure rates, notepad facility, easy to use
menus and forms, wide variety of output options, trade-off studies, and
automatic description of system tree structure.
PC MIL-HDBK-217F (Management Sciences)
Automated reliability prediction program according to MIL-HDBK-217F Notice
1. Features include: menu-driven data loader, duty cycle factors, "what-if"
analysis with temp. & environment, graphics front end with database
manager, thermal profile multiple levels of equipment, interactive component
failure rate generation, global changes. Outputs include MTBF, Lambda and
Pi factors, stress ratios, part/assembly/system failure rates.
PC Stress Analysis (Management Sciences)
Circuit stress analysis package for power and stress calculations on electronic
designs. Provides documentation for MIL-STD-785 stress analysis with optional
output packages for signal levels, waveforms, etc. Accepts CAD/CAE parts
lists and has a graphics front end. Outputs include component overstress
warning and output directly to PC Predictor. DC power, voltage, current
and thermal dissipation are done automatically. Options include extensive
libraries, AC analysis, & transient analysis.
PREVIEW (Systems Effectiveness Associates)
Combines thermal and reliability analysis with a user definable CAD/CAM/CAE
interface. Allows engineers to test the effects of design decisions on
product reliability. Menu driven, with on-line help, it allows reliability
and thermal analysis to be performed concurrently with design. Thermal
program performs the analysis on a full 3D representation of the board.
A complete stress analysis is performed in accordance with MIL-STD-217.
R1 (includes R1-Lite, R1-Engine, R1-Professional and WinR1) (Systems Exchange)
Provides both parts count and full stress prediction methods according
to virtually any reliability standard or model including MIL-HDBK-217E
and F, Bellcore, DTRC-90/010 (mechanical reliability) and the AT&T
model. R1 is supported by a complete parts catalog manager, which provides
access to thousands of piece-parts. R1 includes data on nearly 100,000
piece-parts. In addition to reliability prediction, R1 provides a sophisticated
range of reliability model options, including K of N redundancy with standby
or active state and with or without repair of failed components.
RAM Commander - MIL-HDBK-217 PS (ALD)
MIL-HDBK-217 Module for Parts Stress and Parts Count reliability prediction
is based on MIL-HDBK-217 E, F, F Notice 1, F Notice 2, etc. RAM Commander
is the world pioneering software providing everything for reliability prediction
based on one of the prediction models for electronic (MIL-HDBK-217, Bellcore,
British Telecom, French Telecom, ItalTel, etc.), as well as mechanical
and electro-mechanical equipment . RAM Commander performs additional tasks
related to reliability analysis and evaluation: Reliability Allocation,
Pareto Analysis, Reliability Growth, Temperature curve, Mission Profile,
RBD with Monte Carlo Simulation, Spare Parts Optimization, Maintainability
Prediction, comprehensive parts libraries, user-friendly interface and
easy to use Import/ Export (including to/from FMECA and FMEA).
RAMTOOL (JORI Corp)
This package satisfies the required tasks 201, 203 and 204 of MIL-STD-785
and task 203 (testability) required by MIL-STD-470. Performs reliability
predictions, maintainability predictions, FMEA's, FMECA's, testability
analyses, and reliability modeling.
REAP (Reliability Effectiveness Analysis Program) (Systems Effectiveness
Associates)
Predicts failure rates for components, assemblies, and systems and allows
for sensitivity tests. Capable of interfacing with CAD/CAE systems. Implementation
of MIL-HDBK-217. Program has provisions for input error checking and defaults
for part types. Also, permits inclusion of user-specified modeling factors
e.g., duty cycle and redundancies. Accommodates temperature differentials
and environmental changes at any configuration level.
REAPmate (Reliability Effectiveness Analysis Program for PC) (Systems Effectiveness
Associates)
REAPmate performs stress analysis predictions for PCBs. Supports interfacing
to CAD/CAE packages. Analyzes sensitivity due to temperature, quality,
and environment. Implementation of MIL-HDBK 217. Package offers temperature
scanning during prediction runs, on-line help with pop-up menus. Can generate
reports with optional Pi and Lambda factors for storage, display, or printing.
Rel +4 (Evaluation Software)
Rel +4 calculates failure rates for electronic components based upon
stress, power, voltage, amperage, temperature and in a given environment
in accordance with MIL-HDBK-217F, Notice 1 or Notice 2. Rel +4 can use
user supplied data or operator controlled default values. Rel +4 calculates
the assembly failure rate and assembly MTBF. Non MIL-HDBK-217F Failure
rates can be used and stored by Rel +4. Rel + 4 provides the user with
help message windows from any part of the program.
An integrated visual environment in which failure rate prediction, FMECA
and Reliability Block Diagram analysis are combined. Failure rate predictions
are calculated from the Bellcore standard for electronic parts, the MIL-HDBK-217
standard for electronic equipment and the NSWC-94/LO7 Handbook for mechanical
parts
Rel Plus III (Evaluation Software)
Automated reliability prediction program in accordance with MIL-HDBK-217F
Notice 1. Features include assembly level predictions and system modeling
functions.
RelCalc for Windows - 217 automates the reliability prediction procedure
of MIL-HDBK-217, providing an alternative to tedious, time consuming, and
error prone manual methods. RelCalc features include: user friendly Windows
GUI interface; integrated library functions for rapid recall of often used
parts; very easy to learn and use; comprehensive on-line Help; global editing
functions for quick What-If? trials; define modular, hierarchical system
models with redundancy if desired; supports hybrid circuit reliability
predictions; data import/export functions; and much more!
RelCalc for Windows - Bellcore (T-Cubed
Systems )
RelCalc for Windows - Bellcore automates the reliability prediction procedure
of Bellcore TR-332, providing an alternative to tedious, time consuming,
and error prone manual methods. RelCalc features include: user friendly
Windows GUI interface; integrated library functions for rapid recall of
often used parts; very easy to learn and use; comprehensive on-line Help;
global editing functions for quick What-If? trails; define modular, hierarchical
system models, with redundancy, if desired; supports hybrid circuit reliability
predictions; data import/export functions; and much more!
Relex 217(Relex Software
Corporation)
Relex 217 provides reliability calculations per the latest versions
of MIL-HDBK-217 Part Stress and Parts Count in a user-friendly environment.
Highly acclaimed by both reliability experts and novices, Relex 217 provides
the necessary tools for performing your analyses. Capabilities include
a user friendly interface, powerful CAD Import/ExportWizard, comprehensive
parts libraries containing tens of thousands of parts, scientific graphs,
visual report designer, spelling checker, trade studies, VBA macros, and
much more. Relex is the industry leading R&M software package and incorporates
MIL-HDBK-217, Bellcore, and Mechanical Reliability Predictions, graphical
Reliability Block Diagrams, FMEAs, FMECAs, Maintainability Predictions,
RCM and Life Cycle Cost analyses, and Fault Tree analyses in one completely
integrated tool.
Reliability Parts Stress Prediction (Probabilistic Software)
This program performs an automated reliability prediction according to
MIL-HDBK- 217F, Notice 1, Parts Stress Method; MIL-STD-785B, Task 203,
and MIL-STD-756B, Type III, Method 2005, Task 202.
Reliability Predictor (Mentor Graphics)
Performs part stress prediction in accordance with MIL-HDBK-217E. Combined
with a decision support system, features over 250 reliability models and
capabilities. Can perform parts count on net lists as well as parts list
and preliminary packaging and temperature information. Initial global temperatures
are assigned, assuming all junction temperatures are the same; the analysis
can be refined after simulation by adding voltage, current, and power values.
RL ORACLE (Rome Labs)
Automated MIL-HDBK-217 reliability prediction package, features include
interactive on-line data entry, editing and execution. Inputs include module
numbers, piece part numbers, electrical stress parameters, repair rates
& descriptions, outputs include: MTBF, piece part failure rate and
module/equipment failure rates, and availability.
RPP (Reliability Prediction Program) (Powertronic Systems)
RPP performs reliability prediction analysis in accordance with the parts
count and part stress methods of MIL-HDBK-217. RPP can analyze systems
of any size and complexity, including those with large numbers of assemblies
and parts. RPP features include complete MIL-HDBK-217 support, including
hybrids, support for large designs, active and standby redundancy models
for assemblies, defaults for part parameters, superior report outputs,
global parameter changing for "what-if" studies, sensitivity ranging with
graphs, and part derating analysis. RPP is ideal for analyzing aerospace,
land or marine equipment used in either military or industrial applications.
TECMTBF (Tecnasa Electronica Professional)
This program performs a reliability prediction in accordance with MIL-HDBK-217E.
Has British and Portuguese menus and can communicate with other software
packages developed by company.
Calculates failure rates of electronic components in accordance with the
Reliability Prediction Standards Bellcore TR-NWT-000332, RDF and HRD4 &
5.
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