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| Book
Editorship |
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Bernstein,
Joseph B.Bernstein, et.al, “Physics-of-Failur Based Handbook of Microelectronic Systems,”
Reliability Information Analysis Center,Utica, NY,2008 ISBN-10:1-933904-29-1 |
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Pecht,
Mark White,Joseph B.Bernstein,"Microelectronics Reliability Modeling and Lifetime Evaluation Handbook: Derating and Reliability Prediction Guidelines", NASA JPL,Publication, 2007. |
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Pecht,
Pecht,M.,Bernstein,J.B.,Searls,D.,and Pecherar,M.,"The Korean Electronics Industry", CRC Press, 1997. |
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Hoang,
H.H., Schutz, R., Bernstein, J.B., Vasquez, B., "Multilevel
Interconnection: Issues that Impact Competitiveness", Proceedings
of SPIE 2090, 1993 |
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| Book
Chapters |
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Bernstein,
J.B., "Laser Link-Making," in LIA Handbook of Laser
Materials Processing, Magnolia Publishing, 2001. |
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Stark,
B., Bernstein, J.B., " Reliability Overview," MEMS
Reliability Assurance Guidelines for Space Applications, NASA
Publication, 1998 |
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| Articles
in Refereed Journals |
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Baoguang
Yan, Jin Qin, and J.B. Bernstein, “Reliability Simulation
and Circuit-Failure Analysis in Analog and Mix-signal
Applications” accepted by IEEE Trans. on Device and Mat. Rel., (2009)
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X.
Li, J. Qin, and J.B. Bernstein, “Compact Modeling of MOSFET Wearout Mechanisms for Circuit-Reliability Simulation,” IEEE Trans. on Device and Mat. Rel., vol.
8, no. 1, pp. 98-121 (2008) (Full text:
PDF) |
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D.Heh, C.D. Young, G.A. Brown, P.Y. Hung, A. Diebold, E. Vogel, J.B. Bernstein, and G. Bersuker, “Spatial Distributions of Trapping Centers in Hf02/SiO2 Gate Stack," IEEE Transactions on Electron Devices, vol. 54, no.6, pp. 1338-45 (2007).
(Full text: PDF) |
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X. Li,
J. Qin, B. Huang, X. Zhang, and J.B. Bernstein, “A New SPICE
Reliability Simulation Method for Deep Submicron VLSI
Circuits,” IEEE Trans. on Device and Mat. Rel., vol. 6, no.
2, pp. 247-257 (2006) (Full text:
PDF) |
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X. Li,
J. Qin, B. Huang, X. Zhang, and J.B. Bernstein, “SRAM
Circuit Failure Modeling and Reliability Simulation with
SPICE,” IEEE Trans. on Device and Mat. Rel., vol. 6, no. 2,
pp.235-246 (2006) (Full text:
PDF) |
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Heh D,
Young CD,
Brown GA,
Hung PY,
Diebold A,
Bersuker G,
Vogel EM,
Bernstein JB, “Spatial distributions of trapping centers
in HfO2/SiO2 gate stacks,” Applied Physics Letters, vol. 88,
no.15, pp. c (2006) (Full text:
PDF) |
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Joseph
B. Bernstein, Moshe Gurfinkel, Xiaojun Li, Jörg Walters,
Yoram Shapira and Michael Talmor, “Electronic circuit
reliability modeling,” Microelectronics Reliability, vol.
46, pp. 1957-1979 (2006) (Full text:
PDF) |
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J.S.
Suehle, B. Zhu, Y. Chen and J.B. Bernstein, “Detailed
study and projection of hard breakdown evolution in
ultra-thin gate oxides,” Microelectronics Reliability,
vol. 45, pp. 419-426 (2005) (Full text:
PDF) |
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D.W. Heh,
E.M. Vogel, J.B. Bernstein, “Impact of Substrate Hot Hole
Injection on Ultra-thin Silicon-dioxide Breakdown, ”Applied
Physics Letters, vol. 82, no. 19, pp. 3242-3244 (2003) (Full
text: PDF) |
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L. Yang,
C.K. King, J.B. Bernstein, “Liquid Dispensing Encapsulation
in Semiconductor Packaging,” Microelectronics International,
vol. 20, no. 3, pp. 29-35 (2003) (Full
text: PDF) |
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J. Lee,
W. Zhang, J.B Bernstein, "Analysis of Energy Process Window
of Laser Metal Pad Cut Link Structure," IEEE Transactions on
Semiconductor Manufacturing, vol. 16, no. 2, pp. 299-307
(2003) (Full text: PDF) |
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E.M.,
Vogel, D. Heh, J.B. Bernstein, J.S. Suehle, "Impact of the
Trapping of Anode Holes in Silicon Dioxide Breakdown," IEEE
Electron Device Letters, vol. 23, no. 11, pp. 667-669
(November 2002) (Full text: PDF) |
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L.-S.
Yang, J.B. Bernstein and K.C. Leong, "Effect of the Plasma
Cleaning Process on Plastic Ball Grid Array Package Assembly
Reliability," IEEE Trans. Electronics Packaging
Manufacturing, vol. 25, no. 2, pp. 91-99 (April 2002) (Full
text: PDF) |
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L.-S.
Yang and J.B. Bernstein, "Encapsulation Process Development
for Flexible-Circuit Based Chip Scale Packages," IEEE Trans.
Electronics Packaging Manufacturing, vol. 25, no. 4, pp.
344-354 (October 2002) (Full text:
PDF) |
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E.M.,
Vogel, D. Heh, J.B. Bernstein, "Interaction between
low-energy electrons and defects created by hot holes in
ultrathin Silicon Dioxide," Applied Physics letters,
vol. 80, no. 18, pp. 3343-5 (6 May 2002) (Full text:
PDF) |
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J.S.
Suehle, E.M. Vogel, P. Roitman, J.F. Conley Jr., A.H.
Johnston, B. Wang, J.B. Bernstein, and C.E. Weintraub,
"Observation of Latent Reliability Degradation in Ultra-Thin
Oxides after Heavy-Ion Irradiation," Applied Physics
letters, vol. 80, no. 7, pp. 1282-4 (18 Feb 2002) (Full
text: PDF) |
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J.F.
Conley Jr., J.S. Suehle, A.H. Johnston, B.Wang, T. Miyahara,
E.M. Vogel, J.B. Bernstein, "Heavy-Ion Induced soft
breakdown of thin gate oxides," IEEE Transactions on Nuclear
Science, vol. 48, no. 6, pp. 1913-16 (Dec. 2001) (Full text:
PDF) |
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Zhang,
W., J.-H. Lee, Bernstein, J.B, "Energy Effect of the Laser
Induced Vertical Metallic Link," IEEE Transactions on
Semiconductor Manufacturing, vol. 14, no. 2, pp. 163-169
(2001) (Full text: PDF) |
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Wang,
B., Suehle J.S. ,Vogel E.M., Bernstein, J.B.,
"Time-Dependent Breakdown of Ultra-thin SiO2 Gate
Dielectrics under Pulsed Biased Stress," IEEE Electron
Device Letters, vol. 22, no. 5, pp. 224-226 (2001) (Full
text: PDF) |
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Yang,
L., Bernstein, J.B., Chung, K, "The Impact of Lead-free
Soldering on Electronics packages," Microelectronics
International, vol. 18, no. 3, pp. 20-26 (2001) (Full text:
PDF) |
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Lee, J.,
Zhang, W., Bernstein, J.B., “Scalability Study of
Laser-induced Vertical Make-link Structure," IEEE
Transactions on Semiconductor Manufacturing, vol. 13, no. 4,
pp. 442-447 (2000) (Full text: PDF) |
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Vogel,
E., Suehle, J.S., Edelstein, M.D., Wang, B., Chen, Y.,
Bernstein, J.B., “Reliability of Ultra-thin Silicon Dioxide
Under Combined Substrate Hot Electron and Constant Voltage
Tunneling Stress," IEEE Transactions on Electron Devices,
vol. 47, no.6, pp.1183-91 (2000) (Full text:
PDF) |
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Bernstein, J.B., Lee, J., Yang, G., Dahmas, T., “Analysis of
Laser Metal-Cut Energy Process Window," IEEE Transactions on
Semiconductor Manufacturing, vol.13, no. 2, pp. 228-34
(2000) (Full text: PDF) |
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Shen,
C.C., Hefner, A.R., Jr., Berning, D.W., Bernstein, J.B.,
"Failure Dynamics of the IGBT During Turn-off For Unclamped
Inductive Loading Conditions," IEEE Transactions on Industry
Applications, Vol. 36, no.2, pp.614-24 (2000) (Full text:
PDF) |
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Zhang,
W., Lee, J.H., Chen, Y., Bernstein, J.B., Suehle, J.S.,
"Reliability of laser-induced metallic vertical links," IEEE
Transactions on Advanced Packaging, vol. 22, no.4, pp.
614-19 (1999) |
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Chen,
Y., Suehle, J.S., Shen, C.C., Bernstein, J.B., Messick, C.,
Chaparala, P., "A new technique for determining long-term
TDDB acceleration parameters of thin gate oxides," IEEE
Electron Device Letters, vol. 19, no. 7, pp. 218-21 (1998) |
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Bernstein, J.B., Zhang, W., Nicholas, C.H., "Laser formed
metallic connections," IEEE Transactions on Components,
Packaging, and Manufacturing Technology, Part B: Advanced
Packaging, vol. 21, no. 2, pp. 194-8 (1998) |
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Bernstein, J.B., Hua, Y., Zhang, W., "Laser energy
limitation for buried metal cuts," IEEE Electron Device
Letters, vol. 19, no. 1, pp. 4-6 (1998) |
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Rasera,
R.L., Bernstein, J.B., "Laser linking of metal interconnect:
linking dynamics and failure analysis," IEEE Transactions on
Components, Packaging, and Manufacturing Technology, vol.
19, no. 4, pp. 554-61 (1996) |
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Shen,
Y-L, Suresh, S., Bernstein, J.B., " Laser linking of metal
interconnect: analysis and design considerations," IEEE
Transactions on Electron Devices, vol. 43, no. 3, pp. 402-10
(1996) |
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Bernstein, J.B., Colella, B.D., "Laser-formed metallic
connections employing a lateral link structure," IEEE
Transaction on Components, Packaging, and Manufacturing
Technology, Part A, vol. 18, no. 3, pp.690-2 (1995) |
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Bernstein, J.B., Ventura, T.M., Radomski, A.T., "Laser
induced microfracture leading to high density metal-to-metal
connections," Proceedings of the SPIE, The International
Society for Optical Engineering, vol. 2335, pp. 165-76
(1995) |
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Bernstein, J.B., Ventura, T.M., Radomski, A.I.,
"High-density laser linking of metal interconnect," IEEE
Transactions on Components, Packaging and Manufacturing
Technology, Part A, vol. 17, no.4, pp. 590-3 (1994) |
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Murguia,
J.E., Bernstein, J.B., "Short-time failure of metal
interconnect caused by current pulses," IEEE Electron Device
Letters, vol. 14, no. 10, pp. 481-3 (1993) |
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Cohen,
S.S., Bernstein, J.B., Wyatt, P.W., "Laser-induced line
melting and cutting," IEEE Transactions on Electron Devices,
vol. 39, no. 11, pp. 2480-5 (1992) |
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Cohen,
S.S., Bernstein, J.B., Wyatt, P.W., "The effect of multiple
laser pluses on damage to thin metallic films," Journal of
Applied Physics, vol. 71, no. 2, pp. 630-7 (1992) |
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Bernstein, J.B., Cohen, S.S., Wyatt, P.W., "Metal wire
cutting by repeated application of low-power laser pulses,"
Review of Scientific Instruments, vol. 63, no. 6, pp.
3516-18 (1992) |
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Bernstein, J.B., "Improvements to the Electrically
Stimulated Acoustic Wave method for analyzing bulk space
charge," IEEE Transactions on Electrical Insulation, vol.
27, no.1, pp. 152-61 (1992) |
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Cohen,
S.S., Wyatt, P.W., Burns, J.A., Bernstein, J.B., “The
mechanism of laser-induced vertical links," Journal of the
Electrochemical Society, vol.138, no.10, pp. 3013-18 (1991) |
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Cohen,
S.S., Wyatt, P.W., Bernstein, J.B., “Laser-induced melting
of thin conducting films. II. Heat-dissipating substrates,"
IEEE Transactions on Electron Devices, vol.38, no.9 pp.
2051-7 (1991) |
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Bernstein, J.B., Cooke, C.M., "Electric poling behavior of
polymethylmethacrylate," IEEE Transactions on Electrical
Insulation, vol. 26, no. 6, pp. 1087-93 (1991) |
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Bernstein, J.B., Cooke, C.M., "Bulk space charge behavior in
polymethylethacrylate under an imposed virtual cathode
condition," IEEE Transactions on Electrical Insulation, vol.
26, no. 6, pp. 1080-6 (1991) |
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Bernstein, J.B., “Analysis of the electrically stimulated
acoustic-wave method for observing space charge in
semi-insulating films," Physical Review B (Condensed
Matter), vol.44, no.19, pp. 10804-14 (1991) |
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| Refereed
Conference Proceedings |
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Baoguang
Yan, Jin Qin, Jun Dai, Qingguo Fan, and J.B. Bernstein,“Reliability
Simulation and Design Consideration of High Speed ADC
Circuits,” accepted by 2008 International Integrated
Reliability Workshop (IIRW) Final Report, (October 2008) |
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Jin Qin,
Baoguang Yan, Yossi Shoshany, Druker Roy, Hezi Rahamim and
J.B. Bernstein, “Study of Transistor and Product NBTI
Lifetime Distribution,” accepted by 2008 International
Integrated Reliability Workshop (IIRW) Final Report,
(October 2008) |
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L. Yang, J.B. Bernstein, D. Gajewski and J. Walls, “Predictive Reliability Assessment and Failure Rate Modeling for Electronic Packages,” IMAPS 40th International Symposium on Microelectronics, Final Report, WA5 (November 2007).
(Full text: PDF) |
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M. Gurfinkel, et. al., “Characterization of Interface and Bulk Oxide Traps in SiC MOSFETs with Epitaxialy grown and implanted channels", 2007 International Integrated Reliability Workshop (IIRW) Final Report, 8.3 (October 2007).
(Full text: PDF) |
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J. Qin, X. Li, J.B. Bernstein, “SRAM Stability Analysis Considering Gate Oxide SBD, NBTI and HCI,” 2007 International Integrated Reliability Workshop (IIRW) Final Report, 2.2, (October 2007).
(Full text: PDF) |
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M. Gurfinkel, J. Suehle, J.B. Bernstein, Yoram Shapira, A.J. Lelis, D. Habersat, N. Goldsman, “Ultra-fast Characterization of Transient Gate Oxide Trapping in SiC MOSFETs”, Proc. of the IEEE International Reliability Physics Symposium 2007.
(Full text: PDF) |
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L. Condra, J. Qin and J.B. Bernstein, “State of the Art Semiconductor Devices in Future Aerospace Systems,” Proceedings of the FAA/NASA/DoD Joint Council on Aging Aircraft Conference, Palm Springs, CA (April 2007).
(Full text: PDF) |
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M. Gurfinkel, J. Suehle, J.B. Bernstein, Y. Shapira, "Enhanced Gate Induced Leakage Current in HfO2 MOSFETs due to Remote Interface Trap-Assisted Tunneling", 2006 International Electron Devices Meeting (IEDM) technical digest, pp. 755-758, (Dec 2006).
(Full text: PDF) |
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Bernstein, J. B., “Reliability Qualification at the Maryland-Israel Center for Product Realization,” Proceedings of 16th International Conference of the Israel Society for Quality, pp. 9.2.01 Tel Aviv (November 2006).
(Full text: PDF) |
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J. Qin, J.B. Bernstein, “Non-Arrhenius Temperature Acceleration and Stress-Dependent Voltage Acceleration for Semiconductor Devices Involving Multiple Failure Mechanisms,” 2006 International Integrated Reliability Workshop (IIRW) Final Report, pp. 93-97 (October 2006).
(Full text:
PDF) |
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M. White; C. Vu; C. Nguyen; R. Ruiz; Y. Chen; J.B. Bernstein, “Product Reliability Trends, Derating Considerations and Failure Mechanisms with Scaled CMOS,” 2006 International Integrated Reliability Workshop (IIRW) Final Report, pp. 156-159 (October 2006).
(Full text: PDF) |
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M. Gurfinkel; J. Suehle; J.B. Bernstein; Y. Shapira; A.J.Lelis; D.Habersat; N.Goldsman,
“Ultra-Fast Mearsurement of Vth Instability in SiC MOSFETs due to Positive and Negative Constant Bias Stress,” 2006 International Integrated
Reliability Workshop (IIRW) Final Report, pp.49-53 (Oct. 2006)
(Full text: PDF) |
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Bing Huang; Xiaojun Li; Ming Li; Bernstein, J.; Smidts,
“Study of the impact of hardware fault on software reliability,”
Proceedings. 16th IEEE International Symposium on Software
Reliability Engineering. Chicago, IL, USA (Nov. 2005)
(Full text: PDF) |
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Kuan-Jung Chung; Bernstein, J.B.; Ji Luo; Tuchman, J.A.; Ma,
Z.K.; “Experimental Study for Low Resistance Interline Connections
Using Pulsed Laser Techniques,” Quantum Electronics and Laser
Science 2005, Conference Volume 3, pp.1564 - 1566 (May 2005)
(Full text: PDF) |
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Zhu,
B.; Suehle, I.S.; Vogel, E.; Bernstein, J.B.; “The contribution
of HFO2 bulk oxide traps to dynamic NBTI in pMOSFETs,” IEEE
International Reliability Physics Symposium 2005 Proceedings,
pp. 533 – 537 (April 2005) (Full text:
PDF) |
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Xiaojun Li; Huang, B.; Qin, J.; Zhang, X.; Talmor, M.; Gur,
Z.; Bernstein, J.B.; “Deep Submicron CMOS Integrated Circuit
Reliability Simulation with SPICE,” Quality of Electronic
Design, 2005. ISQED 2005. Sixth International Symposium on,
pp. 382 - 389 (March 2005) (Full text:
PDF) |
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Xiaojun
Li; Walter, J.D.; Bernstein, J.B.; “Simulating and Improving
Microelectronic Device Reliability by Scaling Voltage and
Temperature,” Quality of Electronic Design, 2005. ISQED 2005.
Sixth International Symposium, pp.496 - 502 (March 2005)
(Full text: PDF) |
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Hu Huang, Joseph B. Bernstein, Martin Peckerar, Ji Luo; “Combined
Channel Segmentation and Buffer Insertion for Routability
and Performance Improvement of Field Programmable Analog Arrays,”
Proceedings of the IEEE International Conference on Computer
Design (October 2004) (Full text:
PDF) |
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Ji
Luo; Bernstein, J.B.; Tuchman, J.A.; Hu Huang; “A high performance
radiationhard field programmable analog array.” Proceedings.
5th International Symposium on Quality Electronic Design.
p. 522-7. (Los Alamitos, CA, 2004) (Full text:
PDF) |
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J.S.
Suehle, B. Zhu, Y. Chen, J.B. Bernstein, “Acceleration factors
and mechanistic study of progressive breakdown in small area
ultra-thin gate oxides,” Proceedings of Integrated Reliability
Workshop, Phoenix (Arizona 2004) (Full text:
PDF) |
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B.
Zhu, J.S. Suehle, J.B. Bernstein, “Mechanism for reduced
NBTI effect under pulsed bias stress conditions,” Proceedings
of Integrated Reliability Workshop, Phoenix (Arizona 2004)
(Full text: PDF) |
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Y.
Chen, D. Nguyen, S. Guertin, J.B. Bernstein, M. White, R.
Menke, S. Kayali, “A Reliability Evaluation Methodology for
Memory Chips for Space Applications when Sample Size is Small,”
Proceedings of Integrated Reliability Workshop, Lake Tahoe
(Nevada 2003) (Full text:
PDF) |
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B.
Zhu, J.B. Bernstein, J. Suehle, "Negative bias temperature
instability of deep submicron p-MOSFETs under pulsed bias
stress," Proceedings of Integrated Reliability Workshop,
pp. 125-9 (Nevada 2003) (Full text:
PDF) |
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M.
White, M. Cooper, Y. Chen, J. Bernstein, "Impact of Junction
Temperature on Microelectronic Device Reliability and Considerations
for Space Applications," Proceedings of Integrated Reliability
Workshop, p. 133-6 (Nevada 2003) (Full text:
PDF) |
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X.
Zhang, N. Goldsman, J.B. Bernstein, J.M. McGarrity, “Numerical
and Experimental Characterization of 4H-SiC Schottky Diodes,”
Proceedings of IEEE International Semiconductor Device Research
Symposium, p. 120-1 (2003) (Full text:
PDF) |
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D.
Heh, J.B. Bernstein, E.M. Vogel, "Defect generation
in ultra-thin oxide over large fluence ranges," Proceedings
of Integrated Reliability Workshop, Lake Tahoe (Nevada 2002)
(Full text: PDF) |
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Zhuo
Gao, Ji Luo, Hu Huang, Wei Zhang, J.B. Bernstein, "Reliable
laser programmable gate array technology," Proceedings
International Symposium on Quality Electronic Design, p.
252-6, Los Alamitos (California 2002) (Full text:
PDF) |
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Ji
Luo, Kuan-Jung Chung, Hu Huang, J.B. Bernstein, "Temperature
Dependence of R(on,sp) in Silicon Carbide and GaAs Schottky
diodes," Proceedings of IEEE International Reliability
Physics Symposium, 40th annual (New Jersey 2002) (Full
text: PDF) |
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Ji
Luo, K. Chung, Hu Huang, J.B. Bernstein, "Comparison
of Silicon Carbide Schottky diodes," Proceedings of
2001 GaAs Reliability Workshop (Virginia 2001)
(Full text: PDF) |
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Bernstein,
J.B. and Lee, J, "A Laser Formed MakeLink for Customization
and Repair," Proceedings of IEEE International Symposium
on Semiconductor Manufacturing, pp. 347-350 (California
2001) (Full text:
PDF) |
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B.
Wang, J.B. Bernstein, "Latent Reliability Degradation
of Ultra-Thin Oxides After Heavy Ion and Gamma Irradiation,"
Proceedings of Integrated Reliability Workshop (California
2001) (Full text: PDF) |
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J.S.
Suehle, et.al … J.B. Bernstein, "Challenges of high-k
gate dielectrics for future MOS devices," 6th International
Symposium on Plasma and Process Induced Damage, pp. 90-93
(California 2001) (Full text:
PDF) |
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Vogel,
E., Suehle, J.S., Edelstein, M.D., Wang, B., Chen, Y., Bernstein,
J.B., "Degradation of Ultra-thin SiO2 Under Combined
Substrate Hot Electron and Tunneling Stress," Semiconductor
Interface Specialists Conference, (California 2000) (Full
text: PDF) |
| |
J.
Lee, G. Zhuo and J.B. Bernstein, "Laser Programmable
Multichip Module using Vertical Make-link," Proceedings
of the IEEE Electronic Components and Technology Conference,
pp 932-936 (Nevada 2000) (Full text:
PDF) |
| |
B.
Wang, J. Suehle, E.M. Vogel, J.B. Bernstein, "The Effect
of Stress Interruption and pulsed bias stress on Ultra-Thin
Gate Dielectric Reliability," Proceedings of Integrated
Reliability Workshop (California 2000) (Full text:
PDF) |
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E.
M. Vogel, M. D. Edelstein, C. A. Richter, N. V. Nguyen,
I. Levin, D. L. Kaiser, H. Wu, and J. Bernstein, "Issues
in High-k Gate Dielectrics for Future MOS Devices",
Proceedings of IEEE Microelectronics Reliability Qualification
Workshop (California 2000)
(Full
text: PDF) |
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Suehle,
J.S., Vogel, E., Wang, B., Bernstein, J.B., "Temperature
Dependence of Soft Breakdown and Wear-Out in Sub-3 nm SiO2
Films," International Reliability Physics Symposium -
Conference Proceedings, pp. 33-9 (California 2000) (Full
text: PDF) |
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Zhang,
W., Bernstein, J.B., "Electromigration simulation under
DC/AC stresses considering microstructure," Proceedings
of the IEEE 1999 International Interconnect Technology Conference,
pp. 295, 41-3 (California 1999) |
| |
Shen,
C.C., Kefner, A.R., Jr., Berning, D.W., Bernstein, J.B., "Failure
dynamics of the IGBT during turn-off for unclamped inductive
loading conditions," Conference Record of 1998 IEEE Industry
Applications Conference, p. 3, vol. xxx+2410, 831-9, vol.
2 (New York 1999) |
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Chen,
Y, Suehle, J.S., Shen, C.C., Bernstein, J.B., Messick, C.,
Chaparala, P., "The correlation of highly accelerated
Qbd tests to TDDB life tests for ultra-thin gate oxides,"
1998 IEEE International Reliability Physics Symposium Proceedings.
36th Annual, pp. vii+421, 87-91 (Nevada 1998) |
| |
Bernstein,
J.B., Zhang, W., Nicholas, C.H., "Laser programmable
metallic vias," Proceedings of the IEEE 1998 International
Interconnect Technology Conference, pp. 304, 205-7 (New
York 1998) |
| |
Bernstein,
J.B., Zhang, W., Nicholas, C.H., "Laser formed connections
for programmable wiring," Proceedings of the IEEE 1998
Custom Integrated Circuits Conference, pp. 608, 163-5 (California
1998) |
| |
Chen,
Y., Suehle, J.S., Shen, C.C., Bernstein, J.B., Messick,
C., "A New Technique to Extract TDDB Acceleration Parameters
from Fast Qbd Tests," Proceedings of International
Integrated Reliability Workshop, p. vii+181, 67-9, (California
1997) |
| |
Chen,
Y., Suehle, J.S., Shen, C.C., Bernstein, J.B., Messick,
C., Chaparala, P., "A new technique to extract TDDB
acceleration parameters from fast Qbd tests," 1997
IEEE International Reliability Physics Symposium Proceedings.
36thAnnual, pp. vii+181, 67-9 (California 1997) |
| |
Bernstein,
J.B., "Laser Formed Lateral Metallic Connections,"
Proceedings of the Second International Conference on Beam
Processing of Advanced Materials, pp. 101-104 (Ohio 1995) |
| |
Bernstein,
J.B., Ventura, T.M., Radomski, A.T., "Laser induced
microfracture leading to high density metal-to-metal connections,"
Proceedings of the SPIE, The International Society for Optical
Engineering, pp. 165-76 (Texas 1994) |
| |
Bernstein,
J.B., "Dielectric fracture leading to metallic connections
employing a lateral link structure," Thin Films: Stresses
and Mechanical Properties V. Symposium, MRS pp. xix+901,
833-7 (Massachusetts 1994) |
| |
Bernstein,
J.B., Gleason, E.F., Wetsel, A.E., Liu, E.Z., Wyatt, P.W.,
"Anomalous Behavior of Semi-insulating Silicon Rich
Amorphous Silicon Nitride," Amorphous Insulating Thin
Films Symposium, MRS pp. xii+636, 113-18 (Massachusetts
1993) |
| |
Bernstein,
J.B., Gleason, E.F., Wyatt, P.W., "High density metal
cross-point laser linking," International Conference
on Wafer Scale Integration Proceedings, pp. xi+363, 176-81
(California 1992) |
| |
Bernstein,
J.B., Gleason, E.F., Wyatt, P.W., "A thermally stable
silicon rich amorphous silicon nitride alloy for electronic
device applications," Amorphous Silicon Technology
Symposium, MRS pp. xxv+1198, 667-72 (California 1992) |
| |
Bernstein,
J.B., Cohen, S.S., Wyatt, P.W., "Fatigue of aluminum
films leading to melting by multiple laser pulses,"
Phase Formation and Modification by Beam-Solid Interactions
Symposium,MRS pp. xix+913, 589-93 (Boston 1991) |
| |
Cooke,
C.M., Wright, K.A., Takasu, N., Bernstein, J.B., Gollin,
E., "Calibration of Volume Charge Measurements By Use
of Electron Beam Implantation," 1989 Annual Report.
Conference on Electrical Insulation and Dielectric Phenomena,
pp. 508, 435-41 (Virginia 1989) |
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Bernstein,
J.B., Bahl, S., Schlecht, M.F., "A Low Capacitance Power
MOSFET With an Integral Gate Driver," Proceeding of the
18th Annual IEEE Power Electronics Specialists Conference,
PESC vol. 87, pp. 704, 61-8 (Virginia 1987) |
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| Magazine
Articles |
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J.B. Bernstein, “The Power of Three” (Hebrew), Et Lachshov, Vol. 89, pp. 32-37 (Jul-Aug 2007). |
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J.B. Bernstein, “Scientific Exploration” (Hebrew), Et Lachshov, Vol. 87, pp. 12-15 (May-June 2007). |
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J.B. Bernstein, “Reliable Truth” (In Hebrew), Et Lachshov, Vol. 86, pp. 16-18 (Mar-Apr 2007). |
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J.B. Bernstein, “Good and Bad” (In Hebrew), Et Lachshov, Vol. 82, pp. 16-18 (Dec. 2006) |
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J.B. Bernstein, “Limitations” (In Hebrew), Et Lachshov,
Vol. 80, pp. 22-24 (Sep.-Oct. 2006) |
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J.B. Bernstein, “Comparison of Computers with the Jewish
Soul” (In Hebrew), Et Lachshov, Vol. 79, pp. 22-24 (Jul.-Aug.
2006) |
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J.B. Bernstein, “Chess and Free Choice” (In Hebrew), Et
Lachshov, Vol. 76, pp. 14-17 (May 2006) |
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J.B. Bernstein, “Truth through the Scientific Method” (In
Hebrew), Et Lachshov, Vol. 74, pp. 25-27 (Feb. 2006) |
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J.B. Bernstein, “Education and Technology” (In Hebew), Et
Lachshov, Vol. 67, pp. 22-25 (June 2005) |
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J.B. Bernstein, “The Wonders of Silicon” (In Hebrew), Et
Lachshov (Time to Think), Vol. 66, pp. 28-30 (May 2005) |
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J.B. Bernstein, “The Moon” (In Hebrew), Et Lachshov (Time
to Think), Vol. 64, pp. 30-32 (March 2005) |
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J.B. Bernstein, “Halacha and Engineering Design” Et Lachshov
(Time to Think), Vol. 63, pp. 36-37 (Feb. 2005) |
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J.B. Bernstein, “Statistical Logic” (In Hebrew), Et Lachshov,
Vol. 62, pp. 20-22 (Jan. 2005) |
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J.B.
Bernstein, “That we should not know from failures…” (In
Hebrew), Et Lachshov, Vol. 61, pp. 32-33 (Oct. – Dec. 2004) |
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J.Lee,
J. Ehrmann, D. Smart, J. Griffiths, and J.B. Bernstein, "Analyzing
the process window for laser copper-link processing",
Solid State Technology, (December 2002) |
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Yang,
L., Bernstein, J.B., Chung, K, "The Impact of Lead-free
Soldering on Electronics packages," Microelectronics
International, vol. 18, no. 3, pp. 20-26 (2001) |
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Pecht,
M., Bernstein, J.B., Searls, D., Peckerar, M., Karulkar,
P., "Korea's Focus on Market Dominance," Semiconductor
International, pp. 118-22 (1998) |
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Kump,
H.J., Bernstein, J.B., "The Deal fast-surface states
are probably deep-level impurities in the semiconductor,"
IEEE Circuits and Devices Magazine, vol. 1, no. 6, pp. 17-22
(1985) |
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| Additional
Publications and Proceedings |
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Bernstein, J.B., Qin, J. “Physics Based Reliability Qualification,” 16th International Conference of the Israel Society for Quality, Tel Aviv (November 2006). |
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J.
Qin, B. Huang, J. Walter and J.B. Bernstein, M. Talmor,
“Reliability Analysis of Avionics in the Commercial Aerospace
Industry,” The Journal of the Reliability Analysis Center,
First Quarter, pp. 1-5 (2005) |
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Bernstein,
J.B., "Electronics Parts Life Extension for Military
and Avionic Qualification," Proceedings of Microelectronics
Reliability and Qualification Workshop, Manhattan Beach, CA,
December 2002. |
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Goldsman,
N. and Bernstein, J.B., "Robust Design of Wide Band-Gap
Power Devices," Proceedings of Advanced Electric Power
Systems Conference, Cookeville, TN, May 2002 |
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Zhang,
W., Xie, X., Bernstein, J.B., "Laser-Formed Vertical
Metalic Link and Potential Implementation in Digital Logic
Integration," Proceedings of MAPLD, September 1999 |
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Bernstein,
J.B., "Laser Programmable Interconnections Between
Metal Lines," Military and Aerospace Applications of
Programmable Devices and Technologies Conference, NASA,
September 1998 |
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Stark,
B., Bernstein, J.B., Lawton, R., Swift, G., " The Effects
of Radiation on the Resonant Frequency of a Polysilicon
Microstructure," MEMS Reliability and Qualification
Workshop, NASA, California, August 1998 |
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Johnson,
M., Bernstein, J.B., "Practical, Reliable, Hermetic
Laser Modification of Metallic Interconnect," Microelectronics
Reliability and Qualification Workshop, NASA, California,
June 1998 |
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Cohen,
S.S., Bernstein, J.B., Wyatt, P.W., "Laser-induced
line melting and cutting," 50th Annual Device Research
Conference, Massachusetts, June 1992 |
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Bernstein,
J.B., Cohen, S.S., Wyatt, P.W., "Multiple Pulse Effect
on Aluminum Thin Films," Proceedings of Conference on
Lasers and Electro-Optics, 1991 |
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