 |
Joo-Han Lee, Wei Zhang and Joseph B. Bernstein, "Energy Process Window
Simulation of Laser-induced Vertical Make-link Structure," IEEE
Eletron. Device Lett., submitted for publication. |
|
Wei Zhang and Joseph B. Bernstein, "Energy Effect of
Laser-induced Vertical Metallic Link,"
submitted to IEEE Trans. on Semiconductor Manufacturing, in press |
|
Joo-Han Lee, Wei Zhang and Joseph B. Bernstein, "Scalability
Study of Laser-induced Vertical Make-link Structure," IEEE
Trans. Semiconduct. Manufact., vol.13, no.4, Nov, pp 442-447, 2000. |
|
Joo-Han Lee, Gao Zhuo and Joseph B. Bernstein, "Laser Programmable
Multichip Module using Vertical Make-link," IEEE Electronic Components and
Technology Conference, Las Vegas, pp 932-936, 2000. |
|
Joseph B. Bernstein, Joohan Lee, Gang
Yang, and Tariq A.Dahams, "Analysis
of Laser Metal-Cut Energy Process Window", IEEE Trans. Semiconducter
Manufacture, in press. |
|
Wei ZHang, Xiaoyan Xie and Joseph
B. Bernstein, "Laser-Formed
Vertical Metallic Link and Potential Implementation in Digital Logic Integration,"
Proc. MAPLD, MD, 1999. |
|
Wei Zhang, Joo-Han Lee, Yuan Chen, Joseph
B. Bernstein and John Suehle, "Reliaiblity
of Laser-Induced Metallic Vertical Links," IEEE Trans. Comp. Pack.
and Manuf. Tech., Vol 22, No. 4, pp. 614-619, 1999. |
|
J. B. Bernstein, Wei Zhang and
Carl H. Nicholas, "Laser Programmable Vias", IEEE proc. International Interconnect
Technology Conference, pp. 205, June 1-3, 1998 |
|
J. B. Bernstein, Wei Zhang and Carl H.
Nicholas, "Laser Formed
Metallic Connections", IEEE Trans. Comp. Pack. and Manuf. Tech., Part
B: Advanced Packaging, Vol. 21, No. 2, pp. 194, May 1998. |
|
J.B. Bernstein, Y. Hua, and W. Zhang,
"Laser Energy Limitation for
Buried Metal Cuts," IEEE Elect. Dev. Lett., Vol. 19, No.1, January,
1998 |
|
Y.L. Shen, S. Suresh, and J.B. Bernstein,
``Laser Linking of Metal Interconnect: Analysis and Design Considerations,''
IEEE Transactions on Electron Devices, Vol.43, No.3, March, 1996 |
|
Roy L. Rasera and J. B. Bernstein, "Laser
Linking of Metal Interconnect: Linking Dynamics and Failure Analysis",
IEEE Trans. on Comp., Pack., and Manuf. Tech., Vol. 19, No. 4, December,
1996. |
|
J.B. Bernstein, "Laser Formed Lateral
Metallic Connections," Proc. of the Second Int. Conf. on Beam Proc. of
Adv. Mat., 30 Oct. - 2 Nov. 1995 (ASM International, 1996) |
|
J.B Bernstein and B.D. Colella,"Laser-Formed
Metallic Connections Employing a Lateral Link Structure," IEEE Trans. Comp.
Pack. and Manuf. Tech., Vol. 18, No. 3, September 1995 |
|
J.B. Bernstein, T.M. Ventura, and A.T.
Radomski, "High Density Laser Linking of Metal Interconnect", IEEE Trans
on Comp., Pack., and Manuf. Tech., Vol. 14, No. 4, December, 1994 |
|
J.B. Bernstein, T.M. Ventura, and A.T.
Radomski, "Laser Induced Microfracture Leading to High Density Metal-to-metal
Connections", Proc. of SPIE, Vol. 2335, 1994 |
|
S.S. Cohen, J.B. Bernstein, and P.W. Wyatt,
"Laser Induced Line Melting and Cutting", IEEE Trans. Elect. Dev., Vol.
39, No. 11, 1992 |
|
J.B. Bernstein, E.F. Gleason, A.E. Wetsel,
and P.W. Wyatt, "High Density Metal Cross-point Laser Linking", Proc. of
IEEE International Conference on Wafer Scale Integration, 1992 |
|
S.S. Cohen, P.W. Wyatt, J.A. Burns, and
J.B. Bernstein, "The Mechanism of Laser-induced Vertical Links", J. of
Electrochem. Soc., Vol. 138, No. 10, 1991 |
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