Laser restructuring of semiconductor products has proven critical for achieving adequate die yield in memory chips for nearly three decades. Some companies over this time have tried to utilize the phenomenon of laser programmed metal deletion (fuse or break-link) to program, serialize, or repair production chips economically. However, the continued integration of laser metal cuts in silicon circuitry is fundamentally limited. Electrically programmable alternatives, such as Anti-Fuse, and EEPROM cost much more to fabricate as do most high-density laser linking schemes. As a cheaper and better alternative, MAKELINK^TM by LaserLink Technology (LLT) will Improve your link yield with higher reliability and Increase your bottom line profitability. Laser restructuring for generic circuit use, including programmable functionality and coding applications, and repair, are well known as the least expensive way to implement redundancy, serialization, or unique functionality at sufficiently high speed to compete with alternate technologies.

The barrier to greater penetration of laser processing schemes has been the ability to make a low capacitance, low resistance, ohmic, high reliability, high yield, high density alternative to laser fuses. This barrier has now been eliminated due to a new laser formed MAKELINK^TM that is implemented without any extra processing steps (LOW COST) and is directly compatible with standard multi-level interconnect. Furthermore, the reliability of the laser formed links has been proven to exceed Mil-Hdbk 885-E reliability specification for CLASS B, ground-based operation. These links are as good as the metalization being linked. We also have developed this technology on new metalization systems such as copper and wesee that MAKELINK^TM will soon surpass cutting in all applications where post-process programation is required. The specifications of the linking technology make it perfect for ANALOG and MIXED-SIGNAL, SoC, and all low-cost technologies made with standard metallization.