BOOK CHAPTER

I have completed a section on link making for the Laser Institute of America's "LIA Laser Materials Processing Handbook" due to publish later this year.  Because I have sent the handbook's editors a more detailed and updated version of my section, I have removed the preliminary draft that had been posted.

My section appears in Part III (Electronic Materials Processing), chapter 19.  The contents of this chapter are:

19  Link Cutting
19.1  Redundancy for DRAM and SRAM yield enhancement
19.2  Background and theory
19.3  Hardware and results
19.4  Link making
19.5  Personalization

For information about the handbook address your request to
Tracy@laserinstitute.org.